By American Precision Dicing, Inc.
Wafer back grinding (thinning) and polishing are fundamental processes in semiconductor fabrication. Back grinding meticulously reduces wafer thickness to precise specifications, enabling subsequent steps like die separation and advanced packaging techniques. Our team of seasoned professionals leverages their extensive experience and in-depth knowledge of semiconductor processes to deliver exceptional results. We meticulously select grinding wheels with tailored abrasive materials and precisely controlled grit sizes to ensure precise and uniform material removal during back grinding. Specialized adhesive back grinding tape safeguards your valuable wafers throughout the process, and we utilize deionized water to eliminate contamination concerns.
