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Packaging & AssemblyFabrication & Surface Engineering

APD Precision Wafer Dicing Process

By American Precision Dicing, Inc.

At American Precision Dicing, we are committed to delivering precise, reliable wafer dicing services through a structured, end-to-end process designed for accuracy and customer satisfaction. Each project is carefully managed from the initial discussion to the final shipment, ensuring every detail aligns with the client's specifications and industry standards. Our process typically follows these stages: 1. Project Communication We begin by discussing project specifications with the customer via email or phone to fully understand their requirements. 2. Quotation and Order Acceptance A detailed quote is prepared and sent for approval. Once accepted, the customer ships the materials to our facility. 3. Material Receipt and Inspection Upon arrival, all materials are inspected to ensure they are intact. Any issues are promptly communicated to the customer. 4. Production Planning The production manager creates a tailored processing plan, referencing both industry expertise and our extensive database of prior projects. 5. Surface Protection (if needed) If the wafer surface requires protection, we apply a protective layer to safeguard it during processing. 6. Mounting and Blade Preparation The material is mounted and allowed to cure, and the appropriate diamond blade is selected, installed, and dressed for the task. 7. Dicing and Washing The wafer is diced/cut according to the customer’s exact specifications, followed by a high-pressure wash to ensure a clean, dust-free surface. 8. Quality Assurance The diced wafer undergoes a thorough inspection in QA, with a detailed report provided. 9. Packaging and Shipping Once cleared by QA, the wafer is securely packaged and shipped to the customer. 10. Invoicing Following shipment, an invoice is sent to the customer, completing the order. APD’s comprehensive wafer dicing process ensures the highest standards of accuracy, quality, and quick turnaround, supported by our decades of experience and expertise in semiconductor services. Our precision-driven approach minimizes chipping and ensures clean, consistent cuts, making us a trusted partner for industries requiring exceptional reliability.