By TSMC (Taiwan Semiconductor Manufacturing Company)
On top of the TSMC EDA Tool Certification Program, TSMC collaborates with its ecosystem partners to address the design challenges of new technologies and bring customers solid solutions for design enablement and turnaround time improvement. To better serve our customers with a robust design ecosystem and enable customers’ design with TSMC latest technology, TSMC has been conducting full-line EDA Tool Certification Program with major partners including Cadence, Siemens EDA and Synopsys. The core of the certification program covers the tool solutions to the latest advanced process technologies (A14, A16, N2P, N3C) and 3DFabric offering. The advanced process node certifications cover several silicon-centric categories, including physical implementations (APR for High Density/HPC, Custom Design), timing and power signoffs (STA, Transistor-level STA), electromigration and IR Drop (Gate-level and transistor-level EMIR), physical verifications (DRC, LVS, Dummy Fill), RC extractions (RC), simulators, and thermal.
