By Ebatco
Nanoindentation provides a much more sensitive mechanical test for advanced materials such as nanometer thin films and coatings or nanoscale features on surfaces where more traditional methods of hardness testing or tensile testing would be less useful. The testing instrument used for performing the nanoindentation tests is a Nanomechanical Test System (manufactured by Hysitron, Inc., USA). This Nanomechanical Test System is a high-resolution nanomechanical test instrument that performs nano-scale quasi-static indentation by applying a force to an indenter tip while measuring tip displacement into the specimen. During indentation, the applied load and tip displacement are continuously controlled and/or measured, creating a load-displacement curve for each indent. From the load-displacement curve, nano-hardness and reduced elastic modulus values can be determined by applying the Oliver and Pharr method and a pre-calibrated indenter tip area function and a pre-determined machine compliance value. The instrument can also provide in-situ SPM (scanning probe microscopy) images of the specimen before and after indentation. Such nanometer resolution imaging function is accomplished quickly and easily by utilizing the same tip for imaging as for indentation. The in-situ SPM imaging capability is not only useful in observing surface features, but also critical in positioning the indenter probe over such features for indentation tests. Applications Nanocompression Nanofatigue Nanohardness Nanoimpact Nanoimprint Nanoindentation Nanolithography Nanomachining Nano pull off force Nano pull on force Nanoscale Creep Test Nanoscale Stress Relaxation Test Nanoscratch Nanotensile Nanotribology Nanowear Biological Sample Testing Correlation between Nanoindentation and Other Analytical Analysis Fracture Toughness Friction under Extremely Low Load Mechanical Test on MEMS Beam Nanoindentation in Liquid Nanoindentation under Environmental Control Nanoindentation under High/low Temperature Nanomechanical Property Depth Profile Nano/micro Feature Testing Nano Particle Testing Nanoscale Dynamic Mechanical Analysis Quantum Dot Testing Test and Evaluation of Miniaturized Devices Thin Film Interfacial Adhesion Measured using Nanoscratch Ultra Thin Film Testing Young’s Modulus Instrument Key Specifications Modulus Precision± 1% Displacement Range 15 μm Displacement Resolution 0.02 nm Force Range 30 nN to 10 mN Force Resolution 1 nN Heat Stage Range 5 to 300 C Atmosphere Open Air, Inert Gas ASTM Standard E2546 Standard Practice for Instrumented Indentation Testing
