By VSParticle
VSParticle offers a dry method for generating and depositing pure or alloyed nanoparticles which helps semiconductor leaders reduce costly yield losses and drive innovation through the application of nanoparticles and porous thin films. By providing controlled nanoparticles and tunable nanoporous layers, our technology enables R&D and production teams to obtain reliable reference nanomaterials for studying and validating defectivity, cleaning performance, calibration steps, and inspection accuracy, thereby facilitating performance. VSParticle’s patented spark ablation technology produces and deposits ultra-pure, surfactant-free nanoparticles directly onto any solid substrate, including polymer layers. It can generate particles from over 40 elements and its alloys, maintaining precise size control and surface coverage. This capability enables realistic contamination reference particles, accurate calibration standards, and rapid exploration of new material combinations — all essential for next-generation semiconductor development. Core capabilities VSParticle's patented technology enables: - Size selectivity: Pure metallic particles in the range of 2-200nm. - Material flexibility: Metals, alloys and semi-conductive materials such as Sn, Ni, Au, C, Si and many more. - Substrate type and size flexibility: Depositions on almost all substrates, from wafers, reticles, pellicles, ceramics to polymers. Flat and non-flat. - Dry, one-step process: Ligand-free, solvent-free pure particles - Surface coverage control: From sparse particle depositions to highly porous thin films. We control particle coverage on the substrate by adjusting particle generation rate and printer speed. The SEM images show that lower print speeds result in a higher particle density, while increasing the print speed reduces the number of deposited particles. The graph on the left confirms this inverse relationship between print speed and particle density, illustrating precise, tunable control over surface coverage during deposition.
