By IMT Masken und Teilungen AG
Wafer saws are the default standard for sawing silicon chips within the semiconductor industry. Here at IMT, the same resources are used for the assembly of glass chips. Substrate: all borosilicate glasses Substrate thickness: ≥ 0.3 mm Dimensions: ø ≤200 mm Shape: square, rectangular Edge breakouts: < 50 µm Angle of the saw edge: 90° ± 0.5°
