Some of Silex's early customer products incorporated classical doped poly silicon vias. In 2004, Silex saw its first patented “highly doped silicon” TSV technology (Sil-Via®) integrated by its customer into high volume cell phone application for a 2.5D interposer. This established Silex as a leading provider of through substrate via technologies. Since 2004 we have seen a purpose driven expansion of the portfolio of TSV technologies into metal TSV's in silicon (Met-Via®), for low resistance applications, and more recently through glass via solutions (TGV) in glass substrates for low parasitics in high voltage and high frequency applications.
