By IMT Masken und Teilungen AG
Depending on the application, optical senders and receivers must be hermetically sealed to protect them from environmental influences. In recent years, the TO housing has become firmly established at chip level. Similar structures can be implemented very effectively at wafer level using etching processes. Wafers structured in this way are then bonded to the optical sensor wafer. IMT produces 200-mm wafers in line with customer requests, which can then be further processed by the customer. The minimum wafer thickness is 0.3 mm.
