By SAMCO Inc.
TSV fabricated with Samco deep silicon etching and cathode low-temperature PECVD technologies will improve device performance. Via Hole Fabrication using the Bosch Process Photoresist Ashing Insulation Film Deposition on Via Hole Exposure of Lower Electrode by SiO₂ Etching Cu Plug Exposure by Dry Etching Passivation Film Deposition by PECVD
