Cu-Ni-SnAg Process Flow on Solstice® Copper Plating High-uniformity copper pillar formation. Automated Inter-Metal Rinsing Clean wafer transfer between process steps. Nickel Plating Reliable diffusion barrier deposition. Automated Inter-Metal Rinsing Contamination-free process integration. SnAg Plating Uniform solder cap formation. Finished Cu-Ni-SnAg Pillar Structure Ready for downstream assembly. Photoresist Strip UBM Etch From a seed and patterned wafer to a fully metallized wafer, Solstice provides turnkey metallization processing.
