By Melbourne Centre for Nanofabrication
The process Electron-beam evaporation is a physical vapour deposition method for depositing thin films of metals, oxides and semiconductors in a high vacuum environment. Ultra high purity coating material is placed inside a vacuum chamber, typically as pellets in a crucible. Electron energy is used to heat these pellets, causing the coating material to enter the gas phase. Due to the vacuum environment, the evaporated particles can travel to the substrate without colliding with foreign particles, where they then condense on the substrate surface in a thin film. The uses Electron beam evaporation is used to deposit electronic and optical films for the semiconductor industry and has applications in displays and photovoltaics. High melting point materials can be deposited at high deposition rates, making this a preferred process for refractory metal and ceramic films. The instruments The Intlvac Nanochrome II electron beam evaporation system consists of a 10kV power supply and supports up to sixteen 4 inch wafers or fifteen 6 inch wafers or wafer mounted samples. In addition, the system also supports ion beam assisted deposition and substrate pre-cleaning. Single films or multi-material stacks are easily created using simple layer definitions, while users can also make use of ion-beam pre-cleaning and sample heating. Coating thickness are from 2nm up to 200nm (thickness >200nm by approval). Currently available in the materials library are metals (Al, Cr, Ti, Au, Ag), oxides (SiO2, TiO2, Al2O3, ITO), fluorides (MgF2) and semiconductors (Si, Ge). The ULVAC ei-5 is a high vacuum evaporation system for the deposition of metals and oxides on a various substrate. Single films or multi-material stacks (co-ebeam evaporation) are easily created using simple layer definitions. Features ion-beam pre-cleaning and sample heating capabilities. The Angstrom Nexdep AMOD able to deposit single or multi-stack film. Features ion-beam pre-cleaning and sample stage cooling capabilities. This system is reserved for precious metals and adhesion metals deposition only. The following materials are allowed in the chamber. (Au, Ag, Pt, Pd, Ti, Cr). The AJA-2200-HY is a hybrid thin film deposition system which has six sputter targets, one off-axis sputter target, e-beam source, in-situ ellipsometery and RHEED scanning capability. It is also fitted with a X-Y stage and masking (combinatorial function).
