NW
Packaging & AssemblyFabrication & Surface Engineering

Silicon (Si) Sensor Design, Fabrication, and Testing

By Center for Functional Nanomaterials Brookhaven

Brookhaven’s Instrumentation Department has been designing, fabricating, and testing silicon (Si) sensors for nearly 40 years. These sensors support a wide range of applications, including imaging, tracking, and spectroscopy across photon science, high-energy physics, and nuclear physics. Our Capabilities - Fabrication of complete sensors—such as strip, pixel, drift, and low-gain avalanche diode sensors—in a class 100 cleanroom - Design of sensors on 4-inch or 6-inch wafers - Design of Si charge-coupled device (CCD) sensors, including associated readout and control electronic systems that meet or exceed the state of the art in sensitivity, speed, efficiency, compactness, and power consumption - Development of thermal and mechanical designs of CCD packages - Optimization of devices and process flows via technology computer-aided design simulations - Characterization of sensors at electrical probe stations (current vs. high voltage or capacitance vs. high voltage) - Characterization of the electro-optic performance of sensors and integrated systems, with troubleshooting of identified performance issues - Verification of quality control of all assembly and test operations, including fully automated electro-optic test stands with scripted acquisition, analysis, and reporting functions - Evaluation of CCD electro-optic performance in cryogenic test stands - Access to a cryogenic probe station at Brookhaven’s Center for Functional Nanomaterials and equipment at other user facilities - Integration and test of large-format sensor arrays, up to 12 × 12 cm and 144M pixels - Separation of single sensors from wafers through a laser dicing machine, which enables the cutting of arbitrary shapes, including holes - Engagement with foundry services from design through testing and procurement of custom sensors