By TSMC (Taiwan Semiconductor Manufacturing Company)
IC-Link by imec delivers customized solutions for innovative chip manufacturing, leveraging the expertise and ecosystem of imec, a world-leading research and innovation center for nanoelectronics and digital technologies. IC-Link enables scalable and reliable ASIC development and manufacturing, with design expertise for the most advanced commercial nodes. Its excellent first-time-right record and established design flow provides customers with the confidence needed for the development of their ASICs. IC-Link's innovative sub-system reference design gives AI/HPC customers a head start in their leading node development. Through strategic partnerships with leading IP providers, IC-Link enables streamlined access to customers in markets including data- and telecom, industrial, fintech and medtech. Engagement models go from spec-in to netlist and GDS2 handoff, with more flexible services also available. IC-Link's 2.5D and 3D advanced packaging offering includes silicon interposer and organic substrates, from ASIC co-design through manufacturing. In addition to this, its in-house capabilities cover engineering of volume testing, characterization and qualification services. Growing to high-volume production is seamless with its supply chain management expertise. Customers can benefit from optimized yield management, a single point of contact for all logistics, and aligned capacity planning designed to meet all inventory requirements. Other IC-Link services include volume production of silicon photonics chips with imec-developed state-of-the-art technology and custom wafer processing. Architectural and RTL design - Technology node selection, PPA/cost trade-off, IP selection, SoC architecture - IP integration - RTL design and functional verification - Analog, mixed-signal and RF design Physical design - Advanced node down to N2 - Synthesis and full DFT - Floor-planning, place and route, low-power hierarchical design, physical verification - Analog custom layout 2D, 2.5D and 3D packaging - Substrate, interposer, and package design - Advanced packaging techniques for CoWoS, InFO and SoIC - Signal and power integrity, thermal, mechanical analysis Test development and qualification - Internal ATE capabilities for production test development - Test optimization: test pattern review and conversion, and test-limit review/part-average testing - Qualification: prime standards for automotive, aerospace, industrial, consumer and medical applications; prime test for environmental, mechanical, electrical accelerated lifetime tests and radiation NPI and supply chain management - Single point-of-contact - From prototype to high volume - Yield analysis and optimization
