By Chipwise (NanoPhysics B.V.)
Project Name: Snapdragon 8s gen 4 Device: Xiaomi POCO F7 Category: Die shot Project Year: June, 2025 Qualcomm Snapdragon 8s gen 4 chip die shot The Snapdragon 8s Gen 4 is a flagship-class mobile SoC from Qualcomm built on TSMC’s advanced 4nm process, designed to deliver high-end performance with power efficiency. It features a custom Oryon CPU cluster—derived from Qualcomm’s Nuvia architecture—offering a mix of performance and efficiency cores for demanding workloads, while the upgraded Adreno GPU enables console-level gaming, advanced ray tracing, and high refresh-rate displays. The chip also integrates Qualcomm’s latest Hexagon NPU, optimized for on-device generative AI and machine learning tasks, as well as the Spectra ISP for cutting-edge computational photography and video capture. Combined with support for LPDDR5X memory, UFS 4.0 storage, and the Snapdragon X75 5G modem, the 8s Gen 4 provides a hardware platform tailored for premium smartphones that balance performance, AI acceleration, connectivity, and energy efficiency. Snapdragon 8s Gen 4 chip Frontside view of the Snapdragon 8s Gen4 Snapdragon 8s Gen 4 backside die shot High Resolution Floorplan images available here
