Epoxy Die Attach - Conductive - Non-conductive - UV cure - Snap cure - Anisotropic adhesive Eutectic Die Attach - Preform - Pre-deposited / Back-side metalized - Solder paste - Void-free soldering, flux-free attach High Accuracy Component Placement Flip Chip Thermocompression Glass Sealing Wafer (up to 12”) Deep Access Machines used: Palomar 3880-II, 6500 Die Bonders; SST 5100 Vacuum Reflow System
