By Wintech Nano-Technology Services Pte. Ltd.
Experimental Criteria: JESD22-A108,JESD85 Experimental purpose: The high temperature life test is to accelerate the failure mechanism activated by temperature in the bias state. Prior to HTOL, all test samples were subjected to standard electrical tests at low and high temperatures and burned beforehand. Dynamic operating conditions are suitable for most situations, and the test circuit depends on the specific device. The typical stress voltage is 1.1 times the normal operating voltage. Unless otherwise specified, the stress temperature is maintained at 125°C. The device is tested at a defined point in time. The failure rate is calculated in FITs (Time to Failure). Each FIT represents one failure per 109 device hours. Equipment Capabilities: HPB5C LC2 Temperature description Each test device is individually temperature controlled up to 150W and up to 150°C.Each test device is individually temperature controlled up to 50W and up to 150°C. IO channel 128 256 Number of power 16 10 zone 16 16 Number of slots 16 32 Time/Pass 1000hrs 77ea/ 0 Fail 1000hrs 77ea/ 0 Fail