By Wintech Nano-Technology Services Pte. Ltd.
Introduction to re-ball planting BGA ball planting is ball grid array packaging technology. The emergence of this technology has become the best choice for high-density, high-performance, multi-pin packaging such as CPUs, motherboard south and north bridge chips. (Source: 360 Encyclopedia) 1. Chip packaging classification: BGA, CSP The selection of solder balls: 0.2mm-0.76mm is now on the market Ball planting method: manual ball planting method, fixture ball planting method 2. Use tools 1 Heat gun/soldering iron 2 ESD tweezers 3 Solder suction tape 4 Solder paste 5 Solder balls 6 Dust-free cloth 7 Clean water 8 Soft bristle brush 9 Fixtures/stencils 10 High temperature tape 11 Electrostatic ring 3. Use the fixture ball planting method - Wear an electrostatic ring to prevent static electricity from damaging the chip. Check the appearance of the chip for damage. - Fix the chip with a fixture and clean the residual tin on the chip with a solder suction tape. - Clean the chip with clean water and evenly apply the appropriate amount of solder paste. - Cover with stencil and pour in solder balls; Use the paddles or shake it up and down and left and right so that all the steel mesh holes are covered with solder balls. - Remove the steel mesh, preheat the machine and heat it 230 degrees for 5~10 seconds, heat and fix the solder ball. - Cool down slightly, check the solder balls for false soldering, and apply solder paste for secondary heating. - After cooling, clean the chip with clean water. Check with a magnifying glass that each solder ball is well welded. 4. Manual swing ball planting method - Wear an electrostatic ring to prevent static electricity from damaging the chip and check whether the appearance of the chip is damaged - Secure the chip with high-temperature tape - Solder absorbent tape to clean tin residue and evenly apply solder paste - Use ESD tweezers to fill the chip with solder balls in turn - Heat gun temperature 340 degrees / wind speed 0 gear / time 5~10 seconds
