By IMT Masken und Teilungen AG
How do you produce cost-effective glass components of a consistently high quality with a high throughput? IMT answered this question at an early stage with the conversion to a 200-mm wafer line. Thanks to a future-oriented investment strategy, we now have equipment from the semiconductor industry along the entire value chain. Our machinery - Single Wafer Coater / Developer (200-mm wafers) - Mask aligner (200-mm wafers) - Plasma etching equipment (RIE, 200-mm wafers) - Automatic HF etching systems (200-mm wafers) - Wafer saws (200-mm-Wafer) - Laser Dicer (>200-mm-Wafer) - Laser Driller / Marking System (>200-mm-Wafer) - Automatic wafer cleaner (200-mm wafers) - Automatic optical inspection (200-mm wafers) - SEM with EDX (200-mm wafers) - Coating systems (PVD and sputtering) - Interferometer - Atomic force microscope (AFM) - Confocal laser microscope - Photoresist coating equipment for large formats up to 480 mm x 480 mm - Laser plotters (DWL, direct write laser) for formats up to 800 mm x 600 mm
