By XTPL
XTPL’s Ultra-Precise Dispensing technology enables additive, maskless deposition of conductive and dielectric materials with feature sizes down to 1 μm, including on rough, vertical and 2.5D surfaces. What that makes manufacturable: - 1 μm redistribution lines - Interconnections across steps up to 1000 μm high - Open defect repair for PCB, RDL and FPD panels XTPL Ultra Precise Dispensing: Transparent EMI Shielding Printed on Curved Optics for Defense Applications The presentation will explore how XTPL’s ultra-precise dispensing technology can enable transparent EMI shielding directly on curved optical surfaces, opening new possibilities for advanced defense and optoelectronic applications. Ultra precise Dispensing for Next Generation PCB and Display Repair 1 micrometer, or one-thousandth of a millimeter - that is the scale at which XTPL’s Ultra-Precise Dispensing technology operates. Ultra-Precise Dispensing is used in semiconductors, displays, and PCBs, among other areas where precision and further miniaturization of components are critical. During the meeting, participants will learn more about what is driving the growth of the advanced electronics market today, how UPD technology works, and what makes it stand out from other methods. IEEE Heterogeneous Integration Roadmap (2025 edition) treats XTPL's Ultra-Precise Dispensing as part of the semiconductor packaging toolbox. It is recognised in the latest (2025 edition) IEEE Heterogeneous Integration Roadmap (HIR) [Chapter 25: Additively Manufactured Electronics (AME) for 3DHI] published by the EPS - IEEE Electronics Packaging Society. The AME chapter highlights the shifting paradigm toward ultra-precise additive approaches to solve the scaling and integration bottlenecks: 3DHI (3D Heterogeneous Integration) keeps adding dies, materials and geometries that photolithography and stencil printing handle poorly. Direct-write additive methods take masks and tooling out of that equation, so the process can change as fast as the stack does.
