By XTPL
Ultra-Precise Dispensing* is the cutting-edge nanotechnology achievement, allowing for unparalleled material placement accuracy down to micrometer scales. Feature size range - Ultra-high resolution between 0,5 to 1 μm - High resolution between 1 to 10 μm - Medium resolution between 10 to 50 μm Breakthrough additive technology - Dispensing of ultra-high resolution features: < 1 μm - Photonic sintering enabling resistance: < 1 Ω/μm - Materials compatibility Competitive diameter of 1 µm - Microdots printing - Excellent height to width aspect ratio - Capability to use conductive and non-conductive adhesives Innovative printing across microchannels - Printing structures across different types of microchannels - Direct dispensing of conductive electrodes or photoresist (ex. SU-8) - Fast and reliable solution for microfluidic, med-tech and MEMS Enhanced microcell and TSV filling - Precise filling of microlavities, high aspect ratio vias, microwells - Variety of materials like: conductives, dielectrics, photoresist, quantum dots - Use-cases like QD color conversion, high-density TSV, RDL interconnection, sacrificial layer in MEMS fabrication Redefining High-Frequency Connectivity - High resolution antenna on-chip - No satelite droplets and high uniformity to prevent high frequency signal loses - Wire-bonding interconnection alternative UPD for integration - Specialized in advanced open defect repair for complex tech substrates - Printing tech with 1-8 µm feature size, no specific voltage required, using proprietary nanoink with silver nanoparticles for defect repair - Versatile substrates compatible with various materials, suitable for flat and 2.5D surfaces including glass, silicon, kapton, PEN, PC, PDMS, PET - Precise resistance control at 0.1 Ω/µm, with 5 µm line width and sub-250 nm height, allowing for extensive design flexibility - Pioneering system-on-chip development with conductive/insulating microvias for High-Density Interconnect (HDI) - Ultra-high resolution features below 1 µm using photonic sintering for optimal electrical resistances 3D interconnections within the circuit Stacked chip technology - High density interconnections on stacked chips - Resolution <10 μm/10 μm L/S - No satellite droplets and line width homogeneity to prevent electrical shorts - Application in industries like semiconductors, microelectronics, FPD, MEMS and flexible hybrid electronics STACKED CHIPS Powering MicroLED Integration - Facilitates control, driving and power dispensing of microLED displays - Expands applications in AR/VR, smartwatches and automotive displays MICROLED INTEGRATION We’re pioneering this revolution helping to move forward your ideas.
