By TSMC (Taiwan Semiconductor Manufacturing Company)
TSMC’s 2nm (N2) technology has started volume production in 4Q25 as planned. N2 technology features industry-leading first-generation nanosheet transistor technology, with full-node strides in performance and power consumption to address the increasing need for energy-efficient computing. TSMC also developed low-resistance redistribution layer (RDL) and super high-performance metal-insulator-metal (MiM) capacitors to further boost performance. TSMC N2 technology is the semiconductor industry's most leading production technology, offering the highest levels of density and energy efficiency. With our strategy for continuous enhancements, N2P was introduced as an extension of the 2nm technology family. N2P features further performance and power benefits on top of N2, and volume production is scheduled for the second half of 2026. N2 and its derivatives will further extend TSMC technology leadership well into the future. TSMC's Fab 20 and Fab 22 are the 2nm production facilities
