Four days of interactive experiential learning at AIM Photonics’ Test, Assembly and Packaging (TAP) Facility, Rochester Institute of Technology, and the University of Rochester that will teach you how to test, analyze, and package photonic integrated circuits. DATES: August 4-7, 2026 COURSE TYPE: In-person LOCATION: Rochester, NY Participants will use the AIM Photonics’ Hands on Photonic Education (HOPE) Datacom Kit, a six-chip photonic integrated chip (PIC) kit focused on the fundamental concepts used in data communications, including: Insertion Loss, Interference, Mach-Zehnder Modulation, Germanium Photodetectors, Ring Resonator – Wavelength Division Multiplexing (WDM) / Demultiplexing, WDM Micro-ring Modulation. You will learn: - Passive PIC Testing – Coupling/alignment, waveguide loss, and interference - Active PIC Testing – Modulation (Mach-Zehnder and ring resonator) and photodetection - Packaging – Dicing, die bonding, wire bonding, fiber attach (using both traditional and photonic wire bonding technology) and metrology WHO SHOULD ATTEND? This workshop is intended for those interested in hands-on and demonstration-based experience in testing and packaging photonic integrated circuits (PICs.) Prior PIC design experience equivalent to the AIM Photonics online course PIC1: Fabless Design of Photonic Integrated Circuits is strongly recommended. REGISTRATION: Due to overwhelming interest in the PIC Testing and Packaging Workshop (August 4-7, 2026), registration is full. SCHEDULE-AT-A-GLANCE: Workshop activities will begin at 9 a.m. and end at approximately 5 p.m. each day. An evening networking event for all workshop participants will be held on Thursday, August 6. Day 1 (AIM Photonics TAP Facility): Welcome and Overview, Tour of the TAP facility, Packaging and Testing PICs 101. Days 2 and 3 (Workshop participants will break into two groups and rotate to spend a full day at each of the following locations): Rochester Institute of Technology (RIT) — Active PIC testing (Modulators – Mach-Zehnder and resonator), ring resonators (WDM), and packaging using photonic wire bonding; University of Rochester — Loss, interference (directional couplers, Mach-Zehnder interferometers), photodetectors and SWIR chip characterization. Day 4 (AIM Photonics TAP Facility): PIC Packaging Demonstrations: Wafer Dicing, Die Bonding, Wire Bonding, Fiber Array Attachment, Metrology, and Testing. Attendees are required to bring a laptop in order to analyze data.
