The metals module provides fast, high-throughput metal stacks using e-beam evaporation and sputter deposition techniques. The module has defined processes for over 50 different materials including metals, composite metals, and dielectrics. New materials can be added for research and development. Our sputter processes include high-volume, multiple sputter target systems as well as small- chamber, single-wafer, confocal, or co-deposition sputtering using RF and DC magnetron capabilities. Multiple, 6-pocket e-beam evaporation systems in the module also provide quick- response metal stack processing for lift-off and planetary conformal deposition with holders that fit up to 150-mm wafer sizes.
