By TSMC (Taiwan Semiconductor Manufacturing Company)
TSMC’s Integrated Fan-Out Package on Package (InFO-PoP) technology, the industry’s first 3D wafer-level fan-out package, features a high-density RDL and TIVs to integrate mobile application processors with dynamic random-access memory (DRAM). InFO-PoP has better electrical and thermal performance, and a thinner profile than flip chip package-on-package, because it has no organic substrate or C4 bump.
