By Center for Functional Nanomaterials Brookhaven
The assembly of complex microelectronics requires specialized high-density interconnects. The Instrumentation Department’s High-Density Interconnect and Electronics Assembly (HDI-EA) Laboratory has a multitude of tools for designing and fabricating interconnections—including computer-aided design software and high-tech interconnect equipment—for large international experiments in photon science and particle physics. We also support prototyping and process development for projects in the conceptual stage, with some projects leading to commercial applications. Our Capabilities - Application of a variety of interconnect methods, including wire bonding (aluminum wedge and gold ball), gold stud and solder bumping, flip-chip bonding, and precision die bonding - Protection of wire bonds through encapsulation, underfill, and epoxy dispensing - Evaluation of the strength and integrity of wire-bonded interconnects via pull and die shear mechanical testing - Collaboration with the in-house Electronics Assembly Facility, which specializes in the assembly, troubleshooting, repair, cleaning, and deployment of printed circuit boards (PCBs) - Inspection of interconnects through x-ray imaging to evaluate flip-chip assemblies, ball grid arrays, and PCBs - Determination of the surface roughness, deposition thickness, and size of detectors, substrates, and bumps via 3-D profilometry with a laser scanning confocal microscope - Attachment of surface-mount components to PCBs through reflow soldering using automated pick-and-place systems, including those with through-hole technology - Removal of fluxes, residues, and contaminants from PCBs and substrates by aqueous batch cleaning - Assembly of custom wires for signal and power cables, including coaxial radio-frequency, multiconductor, cord, ribbon, and flex cables
