Both methods are available on 100mm, 150mm, and 200mm substrates. Either method can be run as part of process development or applied as a blanket film with a soft bake. Resist coating is supported by in-house photolithography, including front to back alignment for double sided and topographic devices. Many production flows use both methods at different steps. Spin coating handles planar lithography and blanket surface protection early in the flow, while spray coating takes over once deep features have been etched and conformal resist coverage is required. Selecting the right method for each step lets engineers match the coating approach to the wafer surface, the feature depth, and the resolution needed, rather than forcing a single method across the whole process.
