Rogue Valley Microdevices provides PVD metal deposition services from our U.S.-based, ITAR-registered MEMS fab. We offer both sputtered and evaporated films, including precious metals, on customer-supplied or foundry-provided wafers. Whether you need a blanket metal layer on silicon wafers, a metal mask, or a multi-layer stack with anneal, we develop a custom process around your device. Conductive films play a critical role in the performance, reliability, and electrical functionality of MEMS devices, sensors, and semiconductor components. High-purity, ultra-clean PVD films are fundamental to MEMS fabrication, and depositing them well takes more than a target and a chamber. It takes engineers who build devices with these films every day. Our wafer-level deposition services support everything from early-stage MEMS process development and prototyping through volume production. PVD films can be deposited over thermal oxide or LPCVD films such as silicon nitride and polysilicon, and for films over PVD metal, see our PECVD film options. Every layer is deposited in the same fab, so film composition, thickness, stress, and adhesion stay matched to your MEMS design. Precious Metals as Routine Processing: Gold, platinum, and silver are a normal part of our e-beam processing, while most foundries will not touch them Both Methods In-House: PVD sputter and e-beam evaporation under one roof, so you get the right deposition method, not the only one available Contact Engineering: In-situ RF etch and an optional pre-sputter HF dip remove native oxide before metallization, for strong adhesion and minimized contact resistance Lift-Off Ready: A specialized low-temperature e-beam process keeps the wafer and photoresist cool during thick depositions, built for metal lift-off Ready-to-Ship Inventory: Metalized wafers available in our online shop for supply-chain resilience PVD Deposition Capabilities and Material Options Because we operate both sputtering systems and e-beam evaporators in the same facility, our engineers recommend the deposition method that fits your pattern strategy, film stack, and thermal budget: - PVD sputtering: 50.8mm to 300mm wafer sizes. Film options: Titanium, chrome, aluminum, aluminum copper, aluminum silicon, copper, nickel, tantalum, tungsten; reactive tantalum oxide, tantalum nitride, titanium nitride. Process controls: In-situ RF etch for adhesion and ohmic contact; optional HF dip before aluminum and aluminum alloy films to remove native oxide - E-beam evaporation: 50.8mm, 76.2mm, 100mm, 150mm, and 200mm wafer sizes. Film options: Aluminum, aluminum oxide, chrome, copper, gold, indium, molybdenum, nickel, platinum, silver, tin, titanium, silicon oxide. Process controls: Low-temperature process protects photoresist lift-off profiles; up to six materials deposited in-situ Supported substrates include silicon, silicon-on-insulator (SOI), quartz, sapphire, and other specialty materials. Two line-of-sight routes to the same wafer. Sputtering knocks atoms off a target with a plasma; e-beam evaporation melts a source in a crucible with an electron beam. Both deposit on the single face the flux can reach — the geometry behind lift-off-friendly evaporated films and ultra-clean sputtered films. Sputter Deposition: Ultra-Clean Sputtered Films Quality matters, and we understand that. Our sputter process is designed to deposit ultra-clean metal and metal alloy films. An in-situ RF etch cleans the surface immediately before deposition, removing the native oxide that would otherwise degrade adhesion and raise contact resistance to underlying conductive layers. For aluminum and aluminum alloy films, an optional HF dip just prior to sputtering strips native oxide chemically, further improving ohmic contact between layers. Sputtered metal deposition is an omnidirectional process, which makes it a poor candidate for lift-off patterning. If your process requires metal for lift-off, we offer e-beam evaporation as the solution, backed by our specialized metal lift-off capability. E-Beam Evaporation: Evaporated Films for Lift-Off and Precious Metals While most foundries will not touch precious metals, we consider them a normal part of processing. When your process requires precious metal deposition, e-beam evaporation is an excellent choice for wafers that require lift-off processing. Our e-beam evaporation process provides excellent film-thickness control and can deposit up to six different materials in-situ. We developed a specialized, time-tested low-temperature e-beam evaporation process that keeps the underlying wafer and photoresist cool during deposition, a level of control most foundries cannot achieve while depositing thick layers. E-beam films are available on 50.8mm through 200mm substrates. The process was built specifically for metal lift-off processing. Sputtered or Evaporated? We Help You Choose The right deposition method depends on your pattern strategy, film stack, and thermal budget. Because we run both technologies in the same MEMS foundry, our engineers recommend the method that serves your device rather than the tool that happens to be on the floor. We collaborate with you to optimize deposition parameters for each application, and we share the reasoning behind every process decision. You gain reliable electrical performance, excellent film adhesion, and repeatable wafer-level results. From Prototype to Production Start with a handful of development wafers and scale to recurring production lots without changing suppliers. Need a metal anneal? Include it in your wafer services request. And if your device is still taking shape, our MEMS design services team can help you define the metal stack before the first wafer starts. Request a Quote for PVD Metal Deposition Services Send us your film stack, thickness targets, substrate details, and pattern strategy, and our engineers will come back with a process recommendation and a quote.
