By Wintech Nano-Technology Services Pte. Ltd.
X-ray photoelectron spectroscopy uses the binding energy and quantity of photoelectrons escaping from the range of 1 nanometer to 10nm below the surface of the X-ray excitation material, so as to obtain X-ray photoelectron spectroscopy to determine the elemental composition and elemental chemical and electronic states in the sample. With the help of ion beam ablation, X-ray photoelectron spectroscopy can also achieve depth profiling and is widely used in the analysis of thin film layers and interfaces. Main equipment advantages: - Featuring the world’s first scan-focused X-ray source, it can analyze areas from as small as 7.5 microns - Obtain highly sensitive analytical data results - Fully automated analysis makes it easy to achieve automatic neutralization of insulating samples - High-performance depth analysis, 75mm*75mm stage - Fully automated and highly reliable measurement with optimal energy resolution of less than 0.48 eV (Ag3d5/2) Test application introduction: - Material surface characterization - Elemental chemical valence - Depth testing of the film Introduction to material surface characterization: - Signal source: 1-10nm below the surface. - Surface element/contaminant information is determined using a broad spectrum of 0-1300eV - Fine scanning is used to determine surface elemental/contaminant content - Energy resolution: ~0.48eV - Detection element range: Li~U - Detection accuracy: 0.1~1.0 at% As samples may be affected by air pollutants during transport, Sembcorp Nano will provide surface analysis of the samples as they are situ and surface analysis after 5nm sputter cleaning Elemental chemical valence state: - The peak splitting analysis was performed using the elemental sweep results to obtain the corresponding elemental chemical valence state. - Elemental valence states can be used for analysis: surface oxidation, halogen contamination, compound presumption. - By combining the analysis with the depth results, it can be used to estimate the thickness of the oxide layer. Film depth test: - The sample is analyzed layer by layer by ion sputtering to peel off the outermost layer of the test area. - Analysis depth: 1-500nm - Sputtering depth accuracy: 1-10nm - Sputtering ion source: Argon ions - It can be used to estimate the oxide layer depth, doping content and depth, and analyze the film layer structure.
