By Wintech Nano-Technology Services Pte. Ltd.
Reliability analysis is based on quantitative data for product quality, through experimental simulation, the probability of product performing specific specification functions within a given time and specific use environmental conditions, and successfully completing work objectives, and quantitative data as the basis for product quality assurance. Among them, environmental testing is a common analysis item in reliability analysis. Environmental reliability testing is a test to ensure that the functional reliability of a product is maintained during a specified life span in all environments in which it is intended to be used, transported or stored. The specific test method is to expose the product to natural or artificial environmental conditions to its effect, to evaluate the performance of the product under the actual use, transportation and storage environmental conditions, and to analyze and study the degree of influence of environmental factors and its mechanism of action. Sembcorp Nano Reliability Analysis Laboratory evaluates IC reliability by increasing temperature, humidity, bias voltage, simulated IO and other conditions to accelerate aging according to IC design needs. The main test methods are as follows: TC temperature cycle test Experimental standard: JESD22-A104 Experimental purpose: to accelerate the effect of temperature changes on the sample Test process: Samples are placed in a test chamber where the chamber is circulated between specified temperatures and held at each temperature for at least ten minutes. Temperature extremes depend on the conditions selected in the test method. The total stress corresponds to the number of cycles completed at the specified temperature. Equipment Capabilities: Temperature range-70℃—+180℃ Temperature conversion 15°C/min linear Content volume 160L Inner dimensions W800*H500 * D400mm External dimensions W1000 H1808 D1915mm Number of samples 25 / 3lot Time/Pass 700cycles / 0 Fail 2300cycles / 0 Fail BLT high temperature bias experiment Experimental standard: JESD22-A108 Experimental purpose: Effect of high temperature bias on sample Test process: put the sample into the experimental chamber, power supply set the specified voltage and current limit value, room temperature try run, observe whether the power supply limited current appears, measure whether the voltage at the chip terminal meets the expectation, record the normal temperature current value, chamber set the specified temperature, when the temperature is stable at the set value, the high temperature is powered on and the high temperature current value is recorded Equipment Capabilities: Temperature range+20℃—+300℃ Content volume 448L Inner dimensions W800*H800 * D700mm External dimensions W1450 H1215 D980mm Number of samples 25 / 3lot Time/Pass Shell temperature 125°C, 1000hrs/0 Fail HAST highly accelerated stress test Experimental standard: JESD22-A110/A118 (EHS-431ML, EHS-222MD) Experimental Objective: HAST provides constant multiple stress conditions, including temperature, humidity, pressure, and bias. Performed to evaluate the reliability of unsealed packaged equipment operating in wet environments. Multiple stress conditions accelerate the penetration of moisture through the encapsulation mold compound or along the interface between the outer protective material and the metal conductor passing through the encapsulation. When moisture reaches the surface of the die, the applied potential establishes an electrolytic condition that corrodes the aluminum conductor and affects the DC parameters of the device. The presence of contaminants on the chip surface, such as chlorine, can greatly accelerate the corrosion process. In addition, excess phosphorus in the passivation layer can also react under these conditions. Device One Device Two Equipment Capabilities: Number of samples 25 / 3lot Time/Pass 130℃，85%RH,96hrs/ 0 Fail 110℃，85%RH,264hrs/ 0 Fail Device one Temperature range-105℃—+142.9℃ Humidity range 75%RH—100%RH Pressure range 0.02—0.196MPa Content volume 51L Inner dimensions W355*H355 * D426mm External dimensions W860 H1796 D1000mm 设备二 Temperature range-105℃—+142.9℃ Humidity range 75%RH—100%RH Pressure range 0.02—0.392MPa Content volume 180L Inner dimensions W569*H560 * D760mm External dimensions W800 H1575 D1460mm THB temperature and humidity cycle test Experimental standard: JESD22-A101 Experimental purpose: the effect of temperature and humidity changes on the sample Experimental process: put the sample into the experimental chamber, power supply set the specified voltage and current limit value, room temperature try run, observe whether the power supply limited current appears, measure whether the voltage at the chip terminal meets the expectation, record the normal temperature current value, chamber set the specified temperature, when the temperature stabilizes at the set value, the high temperature is powered on and the high temperature current value is recorded Equipment Capabilities: Temperature range-40℃—+180℃ Humidity range 10%RH—98%RH Temperature slew rate 3℃/min Content volume 784L Inner dimensions W1000*H980 * D800mm External dimensions W1200 H1840 D1625mm Number of samples 25 / 3lot Time/Pass 85℃，85%RH,1000hrs/ 0 Fail The program temperature and humidity cycle, the temperature above 100 °C will be no humidity TSA & TSB temperature shock test Experimental standard: JESD22-A106 Experimental purpose: to accelerate the effect of temperature changes on the sample Test process: the sample is put into the test chamber, the chamber is set at a specified temperature, but before the temperature rises, it is confirmed that the sample has been fixed on the mold, which has prevented damage due to the sample falling into the chamber during the experiment. Equipment Capabilities: TSA TSB Temperature range-70℃—+200℃-65℃—+200℃ Conversion time Within 5min＜20S Content volume 70L 4.5L Inner dimensions W410*H460 * D3700mm W150*H150 * D200mm External dimensions W1310 H1900 D1770mm W1200 H1785 D1320mm Time/Pass
