Working with Palomar Technologies, photonics device manufacturers can: - Optimize return on investment with automated packaging solutions. - Manufacture high-reliability photonics packaging providing for greater longevity. - Reduced cost of ownership with flexible packaging assembly solutions, which can operate in R&D up to production environments. With the push toward smart cities, autonomous vehicles, and 5G, the demand for connected devices and higher capacity networks is steadily growing, thereby increasing the need for light-enabled products and services, ushering photonics into a position of prominence in the world economy. Miniaturization and reduced foot print, reduced power consumption, reduced BOM & assembly costs are among the market challenges. While 80% of the photonics market is optical and data transceivers, light-emitting diodes, quantum technologies, laser diode assemblies, high power laser modules, MEMS devices, bio-photonics, 5G, and all types of sensors make up a growing part. This growth puts strains on the manufacturing of these devices. Packaging Assembly Challenges: - Complicated assembly process (a typical 100G transceiver uses about 30 processes to build) - Extreme number of components to bond (~70 components) - Up to 5 different die bonding techniques Palomar provides a range of flexible packaging solutions for photonics applications.
