Plasmaterials provides all metal bonding to affix sputtering targets to backing plates for systems which do not utilize a bolt-on target assembly. This proprietary process utilizes layers of low vapor pressure metals which have been applied to both the backing plate and the target and are then diffusion bonded together. This bond not only provides the necessary mechanical strength required to hold the two materials together, but it also provides a high thermally and electrically conductive layer for transfer of heat and electricity from the backing plate to the target. In addition, this material provides a differential slip plane to allow for differences in thermal expansion between the target and the backing plate. This prevents the target from debonding or cracking during the heat up and cool down cycle of the plasma deposition process.
