By Intlvac
Intlvac's Icarus system geometry ensures a very flat and uniform deposition front for superior 'lift-off' capability. From pushing the 'go' button to pulling out a finished wafer with 2u of spit-free coating takes less than 90 minutes. High-Precision Thin Film Deposition for Advanced Microelectronic Applications Intlvac Thin Film specializes in high-quality indium film deposition using advanced physical vapor deposition (PVD) techniques. Our process enables precise, clean, and high-performance coatings optimized for cutting-edge applications in quantum computing, focal plane arrays, low-resistance ohmic contacts, and semiconductor device fabrication. Why Indium? Indium is a ductile metal with a low melting point of 156.6 °C, making it ideal for low-temperature microelectronic processes that avoid damage to sensitive components. Its excellent thermal conductivity and chemical compatibility with III-V and II-VI semiconductors make it an essential material for: - High-performance electrical contacts - Efficient heat dissipation in semiconductor devices - Integration into complex crystal structures - Robust interconnects in next-generation computing systems Advantages of PVD Indium Coatings Compared to methods like electroplating, PVD deposition offers: - Superior film adhesion and density - Excellent thickness uniformity - Minimal environmental variation effects - Broader material compatibility - Precise control over thickness and morphology Films grown at cryogenic temperatures further enhance: - Shear strength and adhesion - Columnar crystalline growth - Suppression of lateral atom migration Icarus Indium Coating System Intlvac's Icarus platform is purpose-built for high-throughput, high-precision indium film deposition. Our proprietary system is engineered to deliver industry-leading performance, reliability, and yield. Key Performance Features - Spit-free deposition up to 70 Å/s on 200 mm wafers - High uniformity (<5%) across 8-inch wafers - Textured, small-grain morphology from low-temperature deposition - Excellent feature resolution: - 5-micron feature size - 10-micron pixel pitch - High lift-off process yield: - Collimated flux minimizes sidewall coating - Enables clean pattern definition and precise feature transfer - Shape-flexible bump arrays: - Consistent indium fill for both square and round geometries Lift-Off Process Optimization We use negative photoresist for the lift-off process, offering:
