By TSMC (Taiwan Semiconductor Manufacturing Company)
Integrated Fan-Out (InFO) technology is an innovative wafer-level system integration technology featuring a high-density redistribution layer (RDL) and through-InFO vias (TIVs) for high-density interconnect and performance across a variety of applications, including mobile and high-performance computing (HPC). InFO technology offers 2.5D and 3D options optimized for specific applications.
