By SAMCO Inc.
Samco’s Cathode PECVD technology leverages an RF-driven lower electrode to enable high-rate deposition of SiO2 and SiNx films with excellent step coverage and controllable properties. Utilizing proprietary self-bias deposition and a liquid TEOS source, this process achieves deposition rates exceeding 400 nm/min and allows for the formation of thick films over 10 µm with low internal stress. These features make it ideal for advanced applications, including MEMS, TSV, and OLED fabrication, where low-temperature processes (as low as 80°C) are essential. With safer materials and precise control over film characteristics, Samco’s Cathode PECVD provides a versatile solution for both R&D and production environments.
