By Micro-Hybrid Electronic GmbH
Our automated placement lines enable fast, precise and controlled placement processes. The SMD (surface-mounted device) components are placed in the previously applied solder paste by machine. In the subsequent reflow soldering process, the mechanical fixation and electrical contacting takes place. We work together with renowned machine manufacturers who stand for continuous further development of the processes (e.g. Yamaha, SMT, Göpel, MyData, Uniclean, Kolb). Our procedures and processes are constantly being optimized. - Precise and variable dispensing with Jet Printer - Fast, precise and controlled placement processes - Reflow soldering processes with variable soldering programs; possible variation of parameters: Oxygen content / nitrogen content / with and without vacuum, time and temperature, etc. - Inspection of all circuits using 2D and 3D AOI technology - X-ray inspection / CT scan for non-destructive material testing, localization; volume analysis
