By Loadpoint
Loadpoint has a long history of providing innovative dicing solutions and services to a global client base Machine dicing stands at the forefront of today's technology. Loadpoint is a leader in the field, with a reputation as a pioneer of dicing solutions. Serving a global clientele, Loadpoint merges innovation with precision, from silicon wafers through to optics and ceramics. We have a range of advanced machinery on site and take advantage of our unmatched expertise to solve complex problems. Our capabilities include - Up to 12inch capability. - Loadpoint operate several 6”, 12”and heavy duty dicing saws. - Cut depths from 0.010mm to 55mm - Core drilling and large diameter glass disc production - Resin potting / backfilling for sonar arrays - Post-dicing cleaning (spray and ultrasonic) - 3-axis optical measurement Loadpoint’s philosophy is to be flexible to customer needs, if you have a new or specialist project please contact us and to discuss how we can help. Materials / Jobs processed: - Glass plates with / without chrome masks - Silicon wafers - Carbon graphite block and plate - PZT arrays – sonar, ultrasound - Optical components / photonics - Ceramics – plate, rods and profiles - Speciality and high value metals for the electronics industry, e.g. Molybdenum & Iridium - Electronic component singulation / FR4 boards - MEMs structures Work holding and packaging availability Dicing Tapes - Standard dicing tape: low, medium and high tack blue tape - UV Tapes: standard UV wafer tape. Package / singulation strength thick tape - Green tape – for adding additional thickness to standard dicing tapes Wax - Water and solvent based Mounting Plates - Graphite, glass and stainless steel Chucks - Ceramic vacuum chucks, metal vacuum chucks, mechanical chucks, magnetic chucks, tapeless chucks. We also have the in-house capability to design and manufacture bespoke chucks to suit customer requirements
