Semi-custom devices start with a established, stable, in-production process The cross section of the device is defined by the fabrication process Development of the fabrication process is the expensive, time consuming, and risky part of semiconductor chip development The lateral features are defined by the masks Lateral features are easier and less risky to change RocketMEMS ® die volumes scale with your needs Multiple designs on a run Scalable production volumes: Rapid prototyping 500+ devices Low volume production 1000’s to 10,000’s devices/year High volume production Millions of devices/year Multi-Project Wafer: Many different chip designs are processed on the same wafer Customer provides specification AMFitzgerald designs pressure sensors Silex Microsystems fabricates the chips Customer receives bare pressure sensor die in 4-5 months All die are 100% tested All known-good die Options: Readout electronics, ASIC, Packaging: We can offer support and recommendations
