By Micro-Hybrid Electronic GmbH
We manufacture series and quantities from 1 from samples and prototypes to small and large series. Various soldering techniques are used. In addition to SMT (surface-mounting technology) surface mounting, we also offer SMD assembly with adhesive. Depending on requirements, we use various solder pastes, including lead-free ones. Our sales team will be happy to advise you on individual options. - Reflow soldering / full convection reflow soldering (reflow soldering), - Vapor phase soldering/condensation soldering (vapor phase soldering) - Vacuum soldering SMT Facts and figures Smallest component that can be set by machine: 01005 Inch Other components: SOIC, SOT, SOD, TSOP, MELF, CSP, QFP, BGA etc. Assembly performance: up to 90,000 BE per hour Assembly time: Board populated on both sides with 825 BE (0201 to FBGA484) in 265 seconds Optical 3D inspection of height and position in the µm range Prototypes and sample production Small, medium and large series
