By EV Group
Another hybrid die-to-wafer bonding approach that is currently being evaluated for heterogeneous integration applications is direct placement die-to-wafer (DP-D2W) bonding whereby the dies are transferred to the final wafer individually using a pick-and-place flip-chip bonder. The Figure below shows the manufacturing flow for the DP-D2W bonding process, which costs of three major segments: carrier population, die clean and activation, and direct placement flip chip. Transfer Method: Direct placement of activated dies using Flip Chip Bonder Pros: - Versatile method - Die thickness invariant Cons: - Bonding interface needs to be touched - Die handling especially for multi die stacks such as SRAM, DRAM - Particle management during die placement
