Palomar Advanced Solutions Division helps you become the leader in your market by providing state-of-the art services that are capable of ultra-high precision die attach (epoxy, eutectic, flip chip, thermo-compression, void free vacuum reflow, wafer, deep access), wire bonding (gold wire ball bond, ball bumping, deep access, gold and aluminum wedge bonding, ribbon bonding), and die sorting. Additionally, our Advanced Solutions Division helps to simultaneously deliver tangible working products to your customers. No large investment of capital equipment is needed until your product is proven in the market. The capability to run “short-run-production” at Palomar gives you maximum flexibility, coupled with future plans for high-volume production. At any time, production can be seamlessly transferred to your own facility or to a high-volume outsource partner.
