HRL’s Dry Etch and Deposition module provides critical plasma etching and deposition, ion milling, and plasma/thermal ALD growth services. Our expansive equipment selection addresses technological needs in fabricating nanoscale structures and devices with capabilities for processing partial to 200-mm substrates. Etching capabilities include tools configured for compound semiconductors, nitrides, oxides, metal thin films, polymers, and quartz. Our systems are suitable for submicron anisotropic to higher pressure isotropic etching profiles. Our plasma deposition capabilities include traditional PECVD and ICP- CVD systems capable of low-temperature, low-hydrogen content silicon nitride thin films—enabling lift-off processes—and a reduced thermal budget. The ALD systems can de- posit nitrides, oxides, and metal thin films. Our experienced, diverse staff can facilitate solutions for today’s emerging materials.
