Working with Palomar Technologies telecom, RF power amplifier and 5G/6G manufacturers can: - Increase output and reliability through process development with advanced process control features. - Optimize device lifetime without sacrificing throughput by utilizing Palomar combo bonding (die or wire bonding combined with vacuum reflow). - Optimum return on investment secured with flexible solutions for both LDMOS and GaN. Palomar Technologies provides a wide breath of solutions for the telecom/Datacom markets and RF power amplifiers. Packaging Assembly Challenges: - Processes for GaN Ag Sinter, GaN AuSn, and LDMOS AuSi - Withstanding high thermal and electrical conductivities - High reliability to reduce cycle time and costs
