By TSMC (Taiwan Semiconductor Manufacturing Company)
High-performance computing (HPC) enables cloud-to-edge artificial intelligence (AI) applications. The AI revolution is fueling demand for advanced computing power. TSMC's Integrated HPC Platform for AI merges state-of-the-art logic, high-performance memory, silicon photonics, and TSMC 3DFabric® to unleash the full potential of AI. Leading-edge process technologies now require heterogenous integration with advanced packaging technologies. TSMC's comprehensive wafer-level system integration technologies add new dimensions beyond traditional scaling. Furthermore, a broad IP ecosystem, nurtured through years of TSMC and third-party investment, provides first-time-right design and fast time-to-market. TSMC's Integrated High-Performance Computing Platform for AI includes: - Leading-edge process technologies - TSMC 3DFabric® (3D Silicon Stacking and Advanced Packaging Platform) - Connectivity technologies (SerDes, optical interconnect, and RF technology) - A comprehensive IP ecosystem
