AIM Photonics’ Assembly Design Kit (ADK) integrates packaging considerations into photonics design workflows, enabling chip-package co-design. It includes templates, models and simulation tools that help align photonic integrated circuit designs with AIM Photonics' packaging and assembly processes during early design stages. Current Version: The current version to use with AIM Photonics’ MPW runs is 0.6 Supported Packaging Configurations - Wirebond - Fiber attach Design Integration and Enablement - Integration with current PIC layout workflows - Parametric cells (P Cells) to ensure compatibility with packaging processes - Design templates and verified simulation data Supporting Design Assets - 3D models - PCB design files Supported EPDA Design Tools - Cadence (for PC boards) - GDSFactory - KLayout - Luceda Future Releases (in development): Additional Packaging Approaches - Flip-chip - AIM Photonics electronic interposer-based packaging design - Photonic wirebond support - Microlenses Advanced Design and Simulation Capabilities - RF board-level enablement (RF boards for flip-chip and interposer) - Thermal and RF assembly simulation
