By DB HiTek
Since 2000, LB Semicon has led the bumping business by leveraging extensive mass-production experience and strong technological expertise, and today operates the largest bump production capacity in Korea. In addition, LB Semicon provides a one-stop turnkey service covering the full scope of the Display Driver IC business through its integrated solutions, including COF package services, creating enhanced value for its customers. More recently, LB Semicon has initiated full-scale power semiconductor backend services and is aggressively expanding this business as a core driver of mid- to long-term growth. Factories & Branches: Pyeongtaek Site Bump; Gumi Site COF PKG, Back Grinding & Back Metalization; Anseong Site TEST. Supported Technologies: Comprehensive Bump Solution Services (8”, 12”) (Au, CNA, Cu Pillar, Solder, Micro Bump, NiFe); Wafer-Level Packaging Services (WLCSP, RDL, FOWLP); Display Driver IC Package Turnkey Services (COF); Diverse Test Platform Capabilities (DDI, CIS, PMIC, SoC, Final Test); Power Semiconductor Backend Turnkey Services (BGBM, Taiko Grinding, Electroless Plating); Plasma Dicing Solutions.
