By Jan Koum Center for Nanoscience and Nanotechnology, Tel Aviv University
Manufacturer and model: KARL SUSS MA/BA6 GEN4 Mask Aligner. The SUSS MA/BA6 Mask Aligner (MA) is a high-precision photolithography tool, widely recognized as the benchmark in semiconductor submicron research and microsystems production. This system delivers exceptional accuracy and versatility for advanced microfabrication, providing a reliable photolithography service for laboratories requiring uncompromising results. Designed for all standard lithography applications, the mask aligner (ma) supports wafer sizes of up to 150 mm and enables high-resolution patterning with submicron accuracy. Whether you are utilizing it as a stand-alone photolithography tool or as part of a broader production line, its precision alignment system ensures exceptional layer-to-layer registration, critical for multi-step fabrication processes. The photolithography system features advanced illumination options, including a UV LED light source with adjustable wavelengths to optimize exposure conditions for various resists. When seeking professional photolithography services, equipment flexibility is key; this system supports a wide range of substrates, including silicon, glass, and flexible materials. This makes the mask aligner (ma) ideal for diverse applications such as MEMS, photonics, and IC packaging. Furthermore, its bottom-side alignment (BSA) capability enables precise patterning on both sides of the substrate, a vital feature for complex device fabrication.
