By Wintech Nano-Technology Services Pte. Ltd.
Under the conditions of soldering, transportation, and use of electronic components, mechanical stress is usually generated on the solder joint or device due to vibration, impact bending deformation, etc., and eventually leads to the failure of the solder joint or device. Sembcorp Nano provides push-pull mechanics analysis services to simulate mechanical failure models of solder joints, analyze the causes of solder joint or device failure, and evaluate the reliability of parts through push-pull force testing. 1. The application of thrust test The thrust test in the current mainstream market is mainly to verify the following three points: - Evaluate the reliability of SMD solder joints - Evaluate the reliability of the solder joints between the IC and the PCB - Evaluate the reliability of solder joints in BGA encapsulation parts 2. Tensile test application Tensile testing in the current mainstream market is mainly to verify the following: - Evaluate the reliability of gold wire welds 3. Laboratory push-pull force testing equipment Push-pull machine tester Push-pull force test is also an indispensable dynamic mechanical test to measure the fixed strength and bonding ability of the device, and its scalability is strong, and the solder joint strength can be compared at different rates and push tool heights; Its value is efficient and accurate, and the strength of the material is detected by constant speed movement, which can intuitively and effectively check the reliability of the solder joint.
