Bonding and Debonding Product Portfolio Creating Safe Handling and Flawless Outcomes Brewer Science has the expertise and material portfolio to successfully navigate the entire thin wafer handling process. Our unique proprietary materials, including the WaferBOND® and BrewerBOND® material suites, enable completion of the complex back-end processing of ultrathin wafers with standard semiconductor equipment. These materials allow the wafers to be processed using standard lithographic, passivation, and metallization techniques and tooling. Advantages - Higher yields - Options for debond methods include low-stress thermal slide, room temperature mechanical or laser, and batch chemical release - After separation, the device wafer can be solvent cleaned on standard frames utilizing chemically resistant dicing tapes - Higher throughput and lower cost of ownership Temporary Bonding Process Flow - Device wafer is mounted to a carrier before being thinned - Carrier provides rigid support for the ultrathin wafer during backside processes - Prior to mechanical or laser debonding, the bonded pair is attached to a film frame (device side directly on film frame). Once debonded, the thinned device wafer is on the film frame ready to be cleaned. - Spray cleaning methods are utilized with wet chemistries to remove the bonding materials.
