Our heterogeneous integration and post processing module provides product value in accordance with our quality objectives. We collaborate with internal and external customers to solve planarization, bonding, and dicing problems and develop solutions to meet their needs. The module incorporates chemical mechanical polishing (CMP), optical, scribing, dicing, and inspection tools to process single or multistack wafers with die or multilevel integrated devices. The module has eighteen tools with capabilities from processing partial to 6-inch wafers, providing flexibility to conduct benchtop or automated high-speed processing for various semiconductor materials.
