Jet Process Corporation (JPC) is a privately held thin film deposition service founded in 1991. We are the sole owner and developer of the versatile Jet Vapor Deposition™ (JVD™) process for thin film solders and other thin film metal coatings. We specialize in the deposition of lead free solders, which include eutectic and off-eutectic Gold-Tin, the Tin-Silver-Copper family, and many other lead free solder alloys. We also deposit related adhesion layers and diffusion barriers such as TiPtAu and TiNiAu.
Wallingford
Connecticut
1991
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